EC20 R2.1 是移远通信推出的 LTE Cat 4 无线通信模块，采用 LTE 3GPP Rel.11 技术，支持最大下行速率 150Mbps 和最大上行速率 50Mbps；同时在封装上兼容移远通信 UMTS/HSPA+ UC20 模块以及多网络制式 LTE EC20/EC21/EC25/EG25-G 模块，实现了3G网络与4G网络之间的无缝切换。

The EC25 is a series of LTE Cat 4 IoT modules in an LCC form factor measuring 32.0mm × 29.0mm × 2.4mm. The EC25 delivers maximum downlink rates of 150Mbps and uplink rates of 50Mbps under LTE, and multiple-input multiple-output (MIMO) technology meets demands for data rate and link reliability. The series consists of twelve variants to meet various geographical demands, which can be compared via the table above..

• High-quality 5g + v2x + AP three in one open CPU module based on Hisilicon balong5000 platform • with v2x function • open open CPU architecture • meet IATF 16949 • wide temperature range, strong anti electromagnetic interference ability, high signal sensitivity

Ga6571 is a capacitive touch scheme specially used in the automotive electronics market. It has 32 drive channels and 24 sensing channels, supports 8 "Automotive touch screen, and the sensor pitch is within 5.5mm; Supports sizes up to 10.25 ". Ga6571 can recognize the real-time and accurate position, moving track and touch area of 10 touch points at the same time. It has strong anti-interference ability and supports functions such as waterproof and gloves.

GT911 is a new generation of 5-point capacitive touch scheme specially designed for 7 "~ 8". It has 26 drive channels and 14 sensing channels to meet the requirements of higher touch accuracy. GT911 can recognize the real-time and accurate position, moving track and touch area of five touch points at the same time. The touch information of corresponding points can be read according to the needs of the main control

GT9271 is a new generation of 10 point capacitive touch scheme specially designed for 7 "~ 10.1". It has 32 drive channels and 20 sensing channels to meet the requirements of higher touch accuracy. GT9271 can recognize the real-time and accurate position, moving track and touch area of 10 touch points at the same time. The touch information of corresponding points can be read according to the needs of the main control.

TR3260 is a single chip that can integrate BB / PMIC / RF / PA / memory / LNA / balun. It supports applications in IOT, IPTV, TV, monitoring and other equipment.

GR551X series is a high-performance Bluetooth system level chip (SOC). It supports Bluetooth 5.1 and can be widely used in mobile devices, wearable products and Internet of things (IOT) products. This series of chips can help users develop low-power Bluetooth application products with central role and / or peripheral role.

MB85RS64 is a FRAM (Ferroelectric Random Access Memory) chip in a configuration of 8,192 words × 8 bits, using the ferroelectric process and silicon gate CMOS process technologies for forming the nonvolatile memory cells.

MB85RS2MTAPNF-G-BDERE1 is a FRAM (Ferroelectric Random Access Memory) chip in a configuration of 262,144 words x 8 bits, using the ferroelectric process and silicon gate CMOS process technologies for forming the nonvolatile memory cells. MB85RS2MTA adopts the Serial Peripheral Interface (SPI). The MB85RS2MTA is able to retain data without using a back-up battery, as is needed for SRAM. The memory cells used in the MB85RS2MTA can be used for 1013 read/write operations, which is a significant improvement over the number of read and write operations supported by Flash memory and E2PROM. MB85RS2MTA does not take long time to write data like Flash memories or E2PROM, and MB85RS2MTA takes no wait time.